AD9规则 及处理技巧
AD9 规则检查中英文对照
Rule Violations Count
违反数
Short-Circuit Constraint (Allowed=No) (All),(All)
短路约束=不允许)(全部),(全部)
Un-Routed Net Constraint ( (All) ) 26 Un-Routed
净约束(所有)26
Clearance Constraint (Gap=9mil) (All),(All)
间隙约束(间隙= 9 mil)(全部),(全部)
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All)
功率平面连接规则(救济连接)(扩展= 20 mil)(导体宽= 10 mil)(气隙= 10 mil)(条目= 4)(全部)0
Width Constraint (Min=8mil) (Max=20mil) (Preferred=15mil) (All)
宽度约束(Min = 8 mil)( Max= 20 mil)(优先15例mil)(全部)
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)
高度约束(Min = 0 mil)( Max = 1000 mil)(优先= 500 mil)(全部)
Hole Size Constraint (Min=1mil) (Max=150mil) (All)
孔尺寸约束(Min = 1 mil)( Max = 150 mil)(全部)
Hole To Hole Clearance (Gap=6mil) (All),(All)
洞孔间隙(间隙= 6 mil)(全部),(全部)
Minimum Solder Mask Sliver (Gap=1mil) (All),(All)
最低焊接面罩银(间隙= 1 mil)(全部),(全部)
Silkscreen Over Component Pads (Clearance=1mil) (All),(All)
丝网印刷在组件垫(许可= 1 mil)(全部),(全部)
Silk to Silk (Clearance=1mil) (All),(All)
丝印丝印(间隙= 1 mil)(全部),(全部)
Net Antennae (Tolerance=0mil) (All)
网络天线(耐受= 0 mil)(全部)
Clearance Constraint (Gap=6mil) (InComponent(U1)),(All)
间隙约束(间隙= 6 mil)(InComponent(U1)),(所有)
删掉ROOM就好了
| Net Antennae (Tolerance=0mm) (All) | 0 |
| Silk to Silk (Clearance=0.1mm) (All),(All) | 0 |
| Silkscreen Over Component Pads (Clearance=0.1mm) (All),(All) | |
| Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All) | |
| Hole To Hole Clearance (Gap=0.254mm) (All),(All) | 0 |
| Hole Size Constraint (Min=0.0254mm) (Max=2.54mm) (All) | 4 |
| Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) | 0 |
| Width Constraint (Min=0.254mm) (Max=0.254mm) (Preferred=0.254mm) (All) | |
| Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) | 0 |
| Clearance Constraint (Gap=0.254mm) (All),(All) | 0 |
| Un-Routed Net Constraint ( (All) ) | 0 |
| Short-Circuit Constraint (Allowed=No) (All),(All) |