RC corner，这里的RC指gate跟network的寄生参数，寄生参数抽取工具根据电路的物理信息，抽取出电路的电阻电容值，再以寄生参数文件输入给STA工具，常见的寄生参数文件格式为SPEF。
ICer都知道在集成电路中是多层走线的，专业术语叫metal layer，不同工艺有不同层metal layer，任何两层metal layer间由介电材料隔离，『走线』通过过孔（VIA）连接。Width跟Spacing是衡量绕线的两条最重要的物理设计规则，它们随着工艺的进步逐步减小。 介电材料、绕线材料、线间距、线宽及线的厚度这些物理特性决定了network的RC值。
Network电容：
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耦合电容：Coupling capacitance=e*T/S
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表面电容：Surface capcitance=e*W/H
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边缘电容：Fringe capcitance
决定容值的因素：
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介电常数：e
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线宽：W
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线厚：T
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线间距：S
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介电材料的厚度：H
随着工艺进步，W, S, T 逐代递减，表面电容跟随减小，耦合电容随之增加，耦合电容在总电容中占比增加，当线厚 T 一定时为了减少耦合电容要么增加线间距要么减小介电常数。通常为了减小噪声敏感信号线（如clock net）上的耦合电容，在物理实现时会人为增加对应信号的线宽及线间距，俗称NDR。要减小介电常数需要从材料入手，从 .18开始引入low K介电材料。
Network电阻：
R=r/W*T, r为电阻率，除了跟线宽 W 和线厚 T 相关之外，还跟温度相关，随着温度的上升而增大。
由上面的分析可知，Network的单位电容和单位电阻是不可能同时最大或同时最小的。有了这些铺垫，来看一下不同工艺结点是如何定义RC corner的。
90nm 之前，Cell delay占主导，Network电容主要是对地电容，STA只需要两个RC corner即可：
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Cbest(Cmin): 电容最小电阻最大
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Cworst(Cmax):电容最大电阻最小
90nm 之后，netdelay的比重越来越大，而且network的耦合电容不可忽略，所以又增加了两个RC corner:
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RCbest(XTALK corner): 耦合电容最大，（对地电容*电阻）最小
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RCworst(Delay corner): 耦合电容最小，（对地电容*电阻）最大
至此总共有两个需要setup timing sign-off的RC corner，有四个需要hold timing sign-off的RC corner：
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Setup time sign-off 的RC corner是: Cworst / RCworst
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Hold time sign-off 的RC corner是: Cbest / RCbest / Cworst / RCworst
C-best:
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It hasminimum capacitance. So also known as Cmin corner.
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InterconnectResistance is larger than the Typical corner.
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Thiscorner results in smallest delay for paths with short nets and can be used formin-path-analysis.
C-worst:
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Refers tocorners which results maximum Capacitance. So also known as Cmax corner.
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Interconnectresistance is smaller than at typical corner.
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Thiscorners results in largest delay for paths with shorts nets and can be used formax-path-analysis.
RC-best:
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Refers tothe corners which minimize interconnect RC product. So also known as RC-mincorner.
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Typicallycorresponds to smaller etch which increases the trace width. This results insmallest resistance but corresponds to larger than typical capacitance.
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Corner hassmallest path delay for paths with long interconnects and can be used formin-path-analysis.
RC-worst:
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Refers tothe corners which maximize interconnect RC product. So also known as RC-maxcorner.
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Typicallycorresponds to larger etch which reduces the trace width. This results inlargest resistance but corresponds to smaller than typical capacitance.
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Corner haslargest path delay for paths with long interconnects and can be used formax-path-analysis.
引入的DPT（Double Patterning Technology）之后，在同一层layer上要做两次mask，两次mask之间的偏差，会导致线间距变化，从而影响耦合电容值，需要将这一因素考虑到RC corner中，所以DPT 的RC corner是：Cworst_CCworst, RCworst_CCworst, Cbest_CCbest, RCbest_CCbest.
其中：
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Setup timesign-off 的RC corner是: Cworst_CCworst / RCworst_CCworst
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Hold timesign-off 的RC corner是: Cbest_CCbest / RCbest_CCbest / Cworst_CCworst /RCworst_CCworst
除以上这些corner外，还有一个corner叫Typical corner，对应于DPT的是Ctypical_CCworst, Ctypical_CCbest，这些corner不用于timing sign-off。