| 1 |
JEP70C |
2013 |
Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware(有关电子硬件质量和可靠性的标准和出版物指南) |
Download (下载) |
| 2 |
JESD37A |
2017 |
Lognormal Analysis Of Uncensored Data And Of Singly Right-Censored Data Utilizing The Persson And Rootzen Method（利用Persson和Rootzen方法对无删减数据和单一右删减数据的对数正态分析） |
Download (下载) |
| 3 |
JESD625B |
2012 |
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices（处理静电放电敏感 (ESDS) 设备的要求） |
Download (下载) |
| 4 |
JESD557C |
2015 |
Statistical Process Control Systems(统计过程控制系统) |
Download (下载) |
| 5 |
JESD31E |
|
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES |
Download (下载) |
| 6 |
JS-002-2018 |
2018 |
For Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Device Level (用于静电放电敏感度测试 - 带电设备模型（CDM） - 设备级别 ) |
Download (下载) |
| 7 |
JS-001-2017 |
2017 |
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) -Component Level (静电放电敏感度测试 - 人体模型（HBM）- 器件级别) |
Download (下载) |
| 8 |
J-STD-609B |
|
MARKING, SYMBOLS, AND LABELS OF LEADED AND LEAD-FREE TERMINAL FINISHED MATERIALS USED IN ELECTRONIC ASSEMBLY |
如需要请私信或微信：John-130 |
| 9 |
JESD33B |
2004（R2018) |
Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line（测量和使用电阻温度系数来确定金属化线的温度的标准方法） |
Download (下载) |
| 10 |
JEP157 |
2009 |
Recommended ESD-CDM Target Levels（推荐的 ESD-CDM 目标水平） |
Download (下载) |
| 11 |
JESD22-B114B |
2020 |
Mark Legibility（标记易读性） |
Download (下载) |
| 12 |
JESD22-A113I |
2020 |
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 |
Download (下载) |
| 13 |
JESD22-B113B |
2018 |
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用于手持电子产品的SMT IC的互连可靠性表征的板级循环弯曲测试方法 |
Download (下载) |
| 14 |
JEP162A.01 |
2021 |
JEP162A-01 System Level ESD Part II：Implementation of Effective ESD Robust Designs （系统级ESD第二部分：有效ESD稳健设计的实施 |
Download (下载) |
| 15 |
JESD78E |
2016 |
IC Latch-Up Test(IC锁存测试) |
Download (下载) |
| 16 |
JESD22-A121A |
2008(R2019) |
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes（测试锡和锡合金表面处理中晶须生长的测试方法） |
Download (下载) |
| 17 |
JESD671D |
2018 |
JEDEC JESD671D：2018 Device Quality Problem Analysis and Corrective Action Resolution Methodology（设备质量问题分析和纠正措施解决方法 |
Download (下载) |
| 18 |
JESD74A |
2007（R2019） |
Early Life Failure Rate Calculation Procedure for Semiconductor Components (半导体元件的早期故障率计算程序) |
Download (下载) |
| 19 |
JESD246A |
2020 |
Customer Notification Process for Disasters（客户灾难通知流程） |
Download (下载) |
| 20 |
JS709C |
2018 |
Definition of “Low-Halogen” For Electronic Products(电子产品的 "低卤素 "的定义) |
Download (下载) |
| 21 |
JESD22-A109B |
2011 |
HERMETICITY（气密性） |
Download (下载) |
| 22 |
J-STD-048 |
2014 |
Notification Standard for Product Discontinuance（产品停产通知标准） |
Download (下载) |
| 23 |
JESD217.01 |
2016 |
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages（表征SMT前球栅阵列封装中空隙的测试方法） |
Download (下载) |
| 24 |
JESD97 |
2004 |
Marking, Symbols, And Labels For Identification Of Lead (Pb) Free Assemblies, Components, And Devices - Superseded By J-Std-609, August 2007（用于识别无铅组件、部件和设备的标记、符号和标签–被2007年8月的J-STD-609所取代） |
如需要J-Std-609请私信或微信：John-130 |
| 25 |
JESD237 |
2014 |
Reliability Qualification of Power Amplifier Modules （功放模块可靠性鉴定） |
Download (下载) |
| 26 |
JESD94B |
2015（R2021） |
Application Specific Qualification Using Knowledge Based Test Methodology（使用基于知识的测试方法的特定应用资格） |
Download (下载) |
| 27 |
JESD241 |
2015 |
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities（偏置温度不稳定性的晶圆级 DC 表征程序 |
Download (下载) |
| 28 |
JESD85A |
2021 |
Methods For Calculating Failure Rates In Units Of Fits（以FITS为单位计算故障率的方法 |
Download (下载) |
| 29 |
JESD47K |
2018 |
Stress-Test-Driven Qualification of Integrated Circuits（集成电路的应力测试驱动的鉴定） |
Download (下载) |
| 30 |
JEP161 |
2011 |
System Level ESD Part 1：Common Misconceptions and Recommended Basic Approaches（系统级ESD第一部分：常见的误解和推荐的基本方法） |
Download (下载) |
| 31 |
JESD22-B111A |
2016 |
Board Level Drop Test Method of Components for Handheld Electronic Products(手持式电子产品元件的板级跌落测试方法) |
Download (下载) |
| 32 |
JESD69C |
2017 |
Information Requirements for the Qualification of Silicon Devices（ 硅器件资格认证的信息要求） |
Download (下载) |
| 33 |
J-STD-046 |
2016 |
Customer Notification Standard for Product-Process Changes by Electronic Product Suppliers (电子产品供应商产品工艺变更的客户通知标准) |
Download (下载) |
| 34 |
JESD22-A104F |
2020 |
Temperature Cycling（温度循环） |
Download (下载) |
| 35 |
JESD22-B116B |
2017 |
Wire Bond Shear Test Method（引线键合剪切测试方法） |
Download (下载) |
| 36 |
JESD50C |
2018 |
Special Requirements for Maverick Product Elimination and Outlier Management （Maverick 产品排除和异常品管理的特殊要求） |
Download (下载) |
| 37 |
JESD22-B105E |
2018 |
Lead Integrity（引线完整性） |
Download (下载) |
| 38 |
JESD201A |
2008（R2020) |
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes （锡和锡合金表面处理的锡须敏感性的环境验收要求） |
Download (下载) |
| 39 |
JESD214.01 |
2017 |
Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding （用于表征应力诱导空洞的铜互连金属化的恒温老化方法） |
Download (下载) |
| 40 |
JESD22-A111B |
2018 |
Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices（通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序 |
Download (下载) |
| 41 |
JESD22-B103B.01 |
2016 |
Vibration, Variable Frequency（振动，变频） |
Download (下载) |
| 42 |
JESD22-A117E |
2018 |
Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test（电可擦除可编程 ROM (EEPROM) 程序擦除耐久性和数据保留压力测试） |
Download (下载) |
| 43 |
JESD659C |
2017 |
Failure-Mechanism-Driven Reliability Monitoring (故障机制驱动的可靠性监控) |
Download (下载) |
| 44 |
JEP143D |
2019 |
Solid-State Reliability Assessment and Qualification Methodologies （固体可靠性评估和鉴定方法 ） |
Download (下载) |
| 45 |
JEP001-1A |
2018 |
Foundry Process Qualification Guidelines – Backend Of Line (芯片工厂工艺资格指南 – 生产线后端) |
Download (下载) |
| 46 |
JEP155B |
2018 |
Recommended ESD Target Level for HBM Qualification（HBM认证的推荐ESD目标水平） |
Download (下载) |
| 47 |
JESD91A |
2003（R2016) |
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms（开发电子元件失效机制加速模型的方法 |
Download (下载) |
| 48 |
JESD22-B112B |
2018 |
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature（高温下的表面贴装集成电路的封装翘曲测量） |
Download (下载) |
| 49 |
JESD89-2B |
2021 |
Test Method for Alpha Source Accelerated Soft Error Rate （Alpha 源加速软错误率的测试方法 |
Download (下载) |
| 50 |
JESD62-A |
2002 |
OUTLIER IDENTIFICATION AND MANAGEMENT SYSTEM FOR ELECTRONIC COMPONENTS, RESCINDED January 2009. Replaced by JESD50. |
请参照JESD50 |
| 51 |
JESD22-A122A |
2016 |
Power Cycling（功率循环） |
Download (下载) |
| 52 |
JEP178 |
2021 |
Electrostatic Discharge (ESD) Sensitivity Testing – Reporting ESD Withstand Levels on Datasheets（静电放电 (ESD) 灵敏度测试 – 在数据表上报告 ESD 耐受水平） |
Download (下载) |
| 53 |
JESD226 |
2013 |
RF BIASED LIFE (RFBL) TEST METHOD（射频偏置寿命 (RFBL) 测试方法） |
Download (下载) |
| 54 |
JESD22-B117B |
2014 |
Solder Ball Shear（焊球剪切测试） |
Download (下载) |
| 55 |
JESD86A |
2009（R2020） |
Electrical Parameters Assessment（ 电参数评估） |
Download (下载) |
| 56 |
JESD22-B118 |
2011 |
Semiconductor Wafer and Die Backside External Visual Inspection（半导体晶圆和芯片背面外部外观检查） |
Download (下载) |
| 57 |
JEP001-3A |
2018 |
Foundry Process Qualification Guidelines – Product Level （制造工艺鉴定指南 - 产品级别） |
Download (下载) |
| 58 |
JESD22-A120B |
2014 |
Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices（电子设备中使用的有机材料中水分扩散率和水溶性的测量方法 |
Download (下载) |
| 59 |
JESD22-B101C |
2015 |
External Visual（外观） |
Download (下载) |
| 60 |
JEP001-2A |
2018 |
FOUNDRY PROCESS QUALIFICATION GUIDELINES – FRONT END TRANSISTOR LEVEL（芯片工厂工艺资格指南 – 前端晶体管级） |
Download (下载) |
| 61 |
JESD22-B115A.01 |
2016 |
Solder Ball Pull（焊球拉力 ） |
Download (下载) |
| 62 |
JEP130B |
2016 |
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel) -单位容器包装（管、托盘和卷带）中集成电路的包装和标签指南 |
Download (下载) |
| 63 |
JEP119A |
2003（R2018) |
Procedure for Performing SWEAT（执行 SWEAT 的程序） |
Download (下载) |
| 64 |
JESD22-B110B.01 |
2019 |
Mechanical Shock – Device and Subassembly（机械冲击 - 设备和组件） |
Download (下载) |
| 65 |
JESD22-A107C |
2013 |
Salt Atmosphere（盐雾） |
Download (下载) |
| 66 |
JESD22-A101D.01 |
2021 |
Steady-State Temperature-Humidity Bias Life Test（稳态温度-湿度偏差寿命测试） |
Download (下载) |
| 67 |
JESD22-B106E |
2016 |
Resistance to Solder Shock for Through-Hole Mounted Devices （通孔安装器件的抗焊接冲击性 ） |
Download (下载) |
| 68 |
JESD22-B107D |
2011(R2018) |
Mark Permanency（标记永久性） |
Download (下载) |
| 69 |
JESD22-A103E.01 |
2015 |
High Temperature Storage Life（高温储存寿命） |
Download (下载) |
| 70 |
JS9703 |
2009 |
IPC/JEDEC-9703: Mechanical Shock Test Guideline For Solder Joint Reliability（焊点可靠性的机械冲击测试指南） |
如需要请私信或微信：John-130 |
| 71 |
JEP172A |
2015（R2020) |
Discontinuing Use of the Machine Model for Device ESD Qualification （停止使用机器模型进行设备 ESD 认证） |
Download (下载) |
| 72 |
JESD22-A108F |
2017 |
Temperature, Bias, And Operating Life（温度，偏置和使用寿命） |
Download (下载) |
| 73 |
JESD22-B109C |
2021 |
Flip Chip Tensile Pull（倒装芯片拉伸强度) |
Download (下载) |
| 74 |
J-STD-033D |
2018 |
IPC/JEDEC Standard For Handling, Packing, Shipping, And Use Of Moisture/Reflow Sensitive Surface-Mount Devices（对湿度/回流敏感的表面贴装器件的处理、包装、运输和使用标准） |
如需要请私信或微信：John-130 |
| 75 |
JESD22-B119 |
2018 |
Mechanical Compressive Static Stress Test Method（ 机械抗压静态应力测试法） |
Download (下载) |
| 76 |
JESD89-1B |
2021 |
Test Method for Real-Time Soft Error Rate（实时软错误率的测试方法） |
Download (下载) |
| 77 |
JESD22-A118B.01 |
2021 |
Accelerated Moisture Resistance - Unbiased HAST（加速的耐湿性-无偏的HAST） |
Download (下载) |
| 78 |
JESD22-A119A |
2015 |
Low Temperature Storage Life（低温储存寿命 ） |
Download (下载) |
| 79 |
JESD22-A102E |
2015(R2021) |
Accelerated Moisture Resistance - Unbiased Autoclave （加速的耐湿性-无偏高压灭菌器） |
Download (下载) |
| 80 |
JEP167A |
2020 |
Characterization of Interfacial Adhesion in Semiconductor Packages （半导体封装中界面粘附的表征） |
Download (下载) |
| 81 |
JESD22-A110E |
2015 |
Highly Accelerated Temperature and Humidity Stress Test (HAST) - 高加速温度和湿度应力测试（HAST) |
Download (下载) |
| 82 |
JESD22-A105D |
2020 |
Power and Temperature Cycling（功率和温度循环） |
Download (下载) |
| 83 |
JESD22-B108B |
2010 |
Coplanarity Test for Surface-Mount Semiconductor Devices（ 表面贴装半导体器件的共面性测试 ） |
Download (下载) |
| 84 |
JESD22-A106B.01 |
2016 |
Thermal Shock（热冲击） |
Download (下载) |
| 85 |
JESD22-B100B |
2003(R2016) |
Physical Dimensions（物理尺寸） |
Download (下载) |
| 86 |
J-STD-020E |
2014 |
IPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For Nonhermetic Surface-Mount Devices（非封闭式表面贴装设备的湿度/回流敏感性分类标准） |
如需要请私信或微信：John-130 |
| 87 |
JESD22-A100E |
2020 |
Cycled Temperature-Humidity-Bias with Surface Condensation Life Test （循环温度-湿度-偏差与表面凝结寿命测试 ） |
Download (下载) |
| 88 |
JEP149.01 |
2021 |
Application Thermal Derating Methodologies（应用热降额方法） |
Download (下载) |
| 89 |
JEP118A |
2018 |
Guidelines for GaAs MMIC PHEMT-MESFET and HBT Reliability Accelerated Life Testing （砷化镓MMIC PHEMT-MESFET和HBT可靠性加速寿命测试指南 ） |
Download (下载) |
| 90 |
JEP148B |
2014（R2019) |
Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment（基于失效风险和机会评估物理的半导体器件可靠性鉴定） |
Download (下载) |
| 91 |
JEP153A |
2014（R2019) |
Characterization and Monitoring of Thermal Stress Test Oven Temperatures（热应力测试炉温度的表征和监测） |
Download (下载) |
| 92 |
JEP122H |
2016 |
Failure Mechanisms And Models For Semiconductor Devices （ 半导体器件的失效机制和模型 ） |
Download (下载) |
| 93 |
JEP156A |
2018 |
Chip-Package Interaction Understanding, Identification, and Evaluation（芯片与封装的相互作用的理解、识别和评估） |
Download (下载) |
| 94 |
JESD471 |
1980(R2018) |
Symbol and Label for Electrostatic Sensitive Devices（静电敏感设备的符号和标签） |
Download (下载) |
| 95 |
JEP174 |
2016 |
Understanding Electrical Overstress - EOS （了解电气过载 - EOS） |
Download (下载) |
| 96 |
JEP154 |
2008（R2011) |
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress （在恒定电流和温度应力下表征焊点电迁移的指南） |
Download (下载) |
| 97 |
JEP176 |
2018 |
Adapter Test Board Reliability Test Guidelines(适配器测试板可靠性测试指南) |
Download (下载) |
| 98 |
JEP151 |
2015 |
Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices （测量地球宇宙射线在功率半导体器件中引起的破坏性影响的测试程序） |
Download (下载) |
| 99 |
JEP150.01 |
2013 |
Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components （与组装的固态表面贴装元件相关的压力测试驱动的鉴定和失效机制） |
Download (下载) |
| 100 |
JEP131C |
2018 |
Potential Failure Mode and Effects Analysis (FMEA)-潜在的故障模式和影响分析（FMEA) |
Download (下载) |
| 101 |
JEP158 |
2009 |
Chip Stack with Through-Silicon Vias (TSVS)：Identifying, Evaluating and Understanding Reliability Interactions （具有硅通孔 (TSVS) 的 3D 芯片堆栈：识别、评估和理解可靠性相互作用） |
Download (下载) |
| 102 |
JEP159A |
2015 |
Procedure for the Evaluation of Low-k/Metal Inter/Intra-Level Dielectric Integrity(低 k/金属层间/层内介电完整性评估程序) |
Download (下载) |
| 103 |
JEP160 |
2011（R2016) |
Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices（电子固态晶圆、晶粒和器件的长期储存） |
Download (下载) |
| 104 |
JEP140 |
2002（R2015) |
Beaded Thermocouple Temperature Measurement of Semiconductor Packages （半导体封装的珠状热电偶温度测量 ） |
Download (下载) |
| 105 |
JEP146A |
2009 |
Guidelines for Supplier Performance Rating（供应商绩效评级指南） |
Download (下载) |
| 106 |
JEP170 |
2013 |
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) - 倒装芯片类型组件（FCxGA）的外观检查和控制指南 |
Download (下载) |
| 107 |
JEP139 |
2000（R2012) |
Constant Temperature Aging to Characterize Aluminum Interconnect Metallization for Stress-Induced Voiding （恒温老化表征铝互连金属化的应力诱发空洞现象 ） |
Download (下载) |
| 108 |
JEP134 |
1998 |
Guidelines for Preparing Customer-Supplied Background Information Relating to a Semiconductor-Device Failure Analysis （准备客户提供的与半导体器件故障分析相关的背景信息的指南 |
Download (下载) |
| 109 |
JESD218B.01 |
2016 |
Solid-State Drive (SSD) Requirements and Endurance Test Method（固态硬盘 (SSD) 要求和耐久性测试方法） |
Download (下载) |
| 110 |
JESD670A |
2013 |
Quality System Assessment（质量体系评估） |
Download (下载) |
