COG（Chip On Glass ）

COG（Chip On Glass ）

直接将驱动IC之I/O与显示玻璃基板的电极端子相互连接的方式，COG模块邦定所使用的驱动IC必须先长出凸块(bumping)，液晶面板模块邦定的凸块材质为Au，目前以ACF为连接材料之制造工艺较成熟。

英：

It is a process of connecting electrode terminal of display glass substrate and I/O of Driving IC directly to each other. The Driving IC must have bumping, and the material used for liquid crystal substrate bumping is Au. The manufacturing process, which uses ACF as its connecting material, is more matured.