高通发布骁龙808六核/810八核64位芯片

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The Snapdragon 808 processor is a 64-bit enabled, LTE-equipped chipset for premium mobile computing devices. The Snapdragon 808 processor is anticipated to begin sampling in the second half of 2014 and expected to be available in commercial devices by the first half of 2015.

骁龙808是64位6核心处理器,支持LTE的高端移动设备处理器。808于2014年下半年开始送样。2015年上半年开始量产商用。

主要区别是810是八核。

CPU

Dual-core ARM® Cortex™ A57 and quad-core A53 with 64-bit support

GPU

Qualcomm® Adreno™ 418 GPU

DSP

Hexagon™ V56 DSP (up to 800MHz)

Modem

Integrated 4G LTE Advanced CAT6 World Mode modem, supporting LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO Rev. B, TD-SCDMA and GSM/EDGE

CAT6 speeds of up to 300 Mbps with support for up to 3x20 MHz carrier aggregation on LTE FDD and LTE TDD

4th Generation integrated LTE modem, with support for LTE- Broadcast, LTE multimode dual-SIM (DSDS and DSDA) and HD VoLTE with SRVCC

RF

4th gen power efficient LTE multimode transceiver with Qualcomm RF360™ Front End solution for world mode bands, lower power and PCB reduction

USB

USB 3.0/2.0

Bluetooth

BT 4.1

WiFi

Qualcomm® VIVE™ 2-stream 802.11n/ac with MU-MIMO

GPS

Qualcomm® IZat™ Gen8C

NFC

Supported

Video

4K playback with H.264 (AVC) and H.265 (HEVC) formats

4K capture with H.264 format

DASH supported

Camera

Up to 55 MP Dual ISP

Display

2560x1600 on-device display concurrent with 4K Ultra HD output to HDTV

1080p and 4K external displays supported

Quick Charge

Qualcomm® Quick Charge™ 2.0 technology

PMI8994

Integrated HW

Voltage In = 9V, up to 3A out

Supports parallel charging

Memory/Storage

LPDDR3 933MHz Dual-channel 32-bit (12.8GBps)/eMMC 5.0 SD 3.0 (UHS-I)

Process Technology

20nm

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