Cadence Allegro 问题积累

以后准备把画PCB中遇到的问题在这里记录下来。

ALLEGRO使用（V16.2）-DRC错误代码对照

代码	相关对象	说明
单一字符代码
L	Line	走线
P	Pin	元件脚
V	Via	贯穿孔
K	Keep in/out	允许区域/禁止区域
C	Component	元件层级
E	Electrical Constraint	电气约束
J	T-Junction	呈现T形的走线
I	Island Form	被Pin或Via围成的负片孤铜
错误代码前置码说明
W	Wire	与走线相关的错误
D	Design	与整个电路板相关的错误
M	Soldemask	与防焊层相关的错误
错误代码后置码说明
S	Shape/Stub	与走线层的Shape或分支相关的错误
N	Not Allowed	与不允许的设置相关的错误
W	Width	与宽度相关的错误
双字符错误代码
BB	Bondpad to Bondpad	Bondpad之间的错误
BL	Bondpad to Line	Bondpad与Line之间的错误
BS	Bondpad to Shape	Bondpad与Shape 之间的错误
CC	Package to Package	Package之间的 Spacing 错误
	Symbol Soldermask to Symbol	Soldermask零件防焊层之间的Spacing 错误
DF	Differential Pair Length Tolerance	差分对走线的长度误差过长
	Differential Pair Primary Max Separation	差分对走线的主要距离太大
	Differential Pair Secondary Max Separation	差分对走线的次要距离太大
	Differential Pair Secondary Max Length	差分对走线的次要距离长度过长
DI	Design Constraint Negative Plane Island	负片孤铜的错误
ED	Propagation-Delay	走线的长度错误
	Relative-Propagation-Delay	走线的等长错误
EL	Max Exposed Length	走线在外层（TOP&BOTTOM）的长度过长
EP	Max Net Parallelism Length-Distance Pair	已超过Net之间的平行长度
ES	Max Stub Length	走线的分支过长
ET	Electrical Topology	走线连接方式的错误
EV	Max Via Count	已超过走线使用的VIA的最大数目
EX	Max Crosstalk	已超过Crosstalk值
	Max Peak Crosstalk	已超过Peak Crosstalk值
HH	Hold to Hold Spacing	钻孔之间的距离太近
HW	Diagonal Wire to Hold Spacing	斜线与钻孔之间的距离太近
	Hold to Orthogonal Wire Spacing	钻孔与垂直/水平线之间的距离太近
IM	Impedance Constraint	走线的阻抗值错误
JN	T Junction Not Allowed	走线呈T形的错误
KB	Route Keepin to Bondpad	Bondpad在Keepin之外
	Route keepout to Bondpad	Bondpad在keepout之内
	Via Keepout to Bondpad	Bondpad在Via Keepout之内
KC	Package to Place Keepin Spacing	元件在Place Keepin之外
	Package to Place Keepout Spacing	元件在Place Keepout之内
KL	Line to Route Keepin Spacing	走线在Route Keepin之外
	Line to Route Keepout Spacing	走线在Route Keepout之内
KS	Shape to Route Keepin Spacing	Shape在Route Keepin之外
	Shape to Route Keepout Spacing	Shape在Route Keepout之内
KV	BBVia to Route Keepin Spacing	BBVia在Route Keepin之外
	BBVia to Route Keepout Spacing	BBVia在Route Keepout之内
	BBVia to Via Keepout Spacing	BBVia在Via Keepout之内
	Test Via to Route Keepin Spacing	Test Via在Route Keepin之外
	Test Via to Route Keepout Spacing	Test Via在Route Keepout之内
	Test Via to Via Keepout Spacing	Test Via在Via Keepout之内
	Through Via to Route Keepin Spacing	Through Via在Route Keepin之外
	Through Via to Route Keepout Spacing	Through Via在Route Keepout之内
	Through Via to Via Keepout Spacing	Through Via在Via Keepout之内
LB	Min Self Crossing Loopback Length	无
LL	Line to Line Spacing	走线之间太近
LS	Line to Shape Spacing	走线与Shape 太近
LW	Min Line Width	走线的宽度太细
	Min Neck Width	走线变细的宽度太细
MA	Soldermask Alignment Error Pad	Soldermask Tolerance太小
MC	Pin/Via Soldermask to Symbol Soldermask	Pad与Symbol Soldermask之间的错误
MM	Pin/Via Soldermask to Pin/Via Soldermask	Pad Soldermask之间的错误
PB	Pin to Bondpad	Pin与Bondpad之间的错误
PL	Line to SMD Pin Spacing	走线与SMD元件脚太近
	Line to Test Pin Spacing	走线与Test元件脚太近
	Line to Through Pin Spacing	走线与Through元件脚太近
PP	SMD Pin to SMD Pin Spacing	SMD元件脚与SMD元件脚太近
	SMD Pin to Test Pin Spacing	SMD元件脚与Test元件脚太近
	Test Pin to Test Pin Spacing	Test元件脚与Test元件脚太近
	Test Pin to Through Pin Spacing	Test元件脚与Through元件脚太近
	Through Pin to SMD Pin Spacing	Through元件脚与SMD元件脚太近
	Through Pin to Through Pin Spacing	Through元件脚与Through元件脚太近
PS	Shape to SMD Pin Spacing	Shape与SMD元件脚太近
	Shape to Test Pin Spacing	Shape与Test元件脚太近
	Through Pin to Shape Spacing	Through元件脚与Shape太近
PV	BBVia to SMD Pin Spacing	BBVia与SMD元件脚太近
	BBVia to Test Pin Spacing	BBVia与Test元件脚太近
	BBVia to Through Pin Spacing	BBVia 与Through元件脚太近
	SMD Pin to Test Via Spacing	SMD Pin与Test Via太近
	SMD Pin to Through Via Spacing	SMD Pin与Through Via太近
	Test Pin to Test Via Spacing	Test Pin与Test Via太近
	Test Pin to Through Via Spacing	Test Pin与Through Via太近
	Test Via to Through Pin Spacing	Test Via与Through Pin太近
	Through Pin to Through Via Spacing	Through Pin与Through Via太近
RC	Package to Hard Room	元件在其他的Room之内
RE	Min Length Route End Segment at 135Degree	无
	Min Length Route End Segment at 45/90Degree	无
SB	135Degree Turn to Adjacent Crossing Distance	无
	90Degree Turn to Adjacent Crossing Distance	无
SL	Min Length Wire Segment	无
	Min Length Single Segment Wire	无
SN	Allow on Etch Subclass	允许在走线层上
SO	Segment Orientaion	无
BB	Bondpad to Bondpad	Bondpad之间的错误
SS	Shape to Shape	Shape之间的错误
TA	Max Turn Angle	无
VB	Via to Bondpad	Via 与Bondpad之间的错误
VG	Max BB Via Stagger Distance	同一段线的BB Via之间的距离太长
	Min BB Via Gap	BB Via之间太近
	Min BB Via Stagger Distance	同一段线的BB Via之间的距离太近
	Pad/Pad Direct Connect	Pad 在另一个Pad 之上
VL	BB Via to Line Spacing	BB Via与走线太近
	Line to Through Via Spacing	走线与Through Via太近
	Line to Test Via Spacing	走线与Test Via太近
VS	BB Via to Shape Spacing	BB Via与Shape太近
	Shape to Test Via Spacing	Shape 与Test Via太近
	Shape to Through Via Spacing	Shape与Through Via太近
VV	BB Via to BB Via Spacing	BB Via之间太近
	BB Via to Test Via Spacing	BB Via与Test Via太近
	BB Via to Through Via Spacing	BB Via与Through Via太近
	Test Via to Test Via Spacing	Test Via之间太近
	Test Via to Through Via Spacing	Test Via与Through Via太近
	Through Via to Through Via Spacing	Through Via之间太近
WA	Min Bonding Wire Length	Bonding Wire 长度太短
WE	Min End Segment Length	无
	Min Length Wire End Segment at 135Degree	无
	Min Length Wire End Segment at 45/90Degree	无
WI	Max Bonding Wire Length	Bonding Wire 长度太长
WW	Diagonal Wire to Diagonal Wire Spacing	斜线之间太近
	Diagonal Wire to Orthogonal Wire Spacing	斜线与垂直/水平线之间的距离太近
	Orthogonal Wire to Orthogonal Wire Spacing	垂直/水平线之间的距离太近
WX	Max Number of Crossing	无
	Min Distance between Crossing	无
XB	135 Degree Turn to Adjacent Crossing Distance	无
	90 Degree Turn to Adjacent Crossing Distance	无
XD	Externally Determined Violation	无
XS	Crossing to Adjacent Segment Distances	无