(Note)硬件领域SCI期刊

A+:

IEEE Journal of Solid-State Circuits (芯片皇冠JSSC大陆2020年之前平均一年发一篇,非常稀缺,但是随着大陆高校科研实力的增强已经慢慢变多了)

A:

IEEE Transactions on Microwave Theory and Techniques (传统专业顶刊,不解释)

IEEE Transactions on Circuits and Systems I: Regular Papers

IEEE Transactions on Terahertz Science and Technology(也是MTT-S办的,发的 人比较少,实验硬件门槛较高,200-300GHz以上的工作才能不out of scope)

B+:

IEEE Solid-State Circuits Letters (刚建刊没多久,未来不可小觑)

IEEE Microwave and Wireless Technology Letters(原名IEEE Microwave and Wireless Components Letters,是MTT-S下的快报,含金量较高)

IEEE Transactions on Circuits and Systems II: Express Briefs (MTT投不上的转战到这儿的挺多的,TCAS-II内容相对鱼龙混杂)

B:

IEEE Microwave Magazine(发文量少,综述偏多,相对小众)

B-:

IET Microwaves, Antennas & Propagation (传统IET老牌期刊)

IET Electronic Letters

IEEE Transactions on Components Packaging and Manufacturing Technology

IEEE Transactions on Advanced Packaging

C+: (芯片设计类的发在上面的还真不多)

Microwave and Optical Technology Letters

C以及以下:(芯片设计类的发在上面的还真不多)

AEUE - International Journal of Electronics and Communications

IEEE ACCESS (名声不好,适合博士生混毕业,以后混学术圈的慎发)

INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING

Wireless Communications and Mobile Computing

International Journal of Antennas and Propagation

Microelectronics Journal

Journal of Circuits, Systems, and Computers

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