Altium Designer PCB设计规则中英对照

Electrical(电气规则)

Clearance:安全间距规则

Short Circuit:短路规则

UnRouted Net:未布线网络规则

UnConnected Pin:未连线引脚规则

 

Routing(布线规则)

Width:走线宽度规则

Routing Topology:走线拓扑布局规则

Routing Priority:布线优先级规则

Routing Layers:布线板层线规则

Routing Corners:导线转角规则

Routing Via Style:布线过孔形式规则

Fan out Control:布线扇出控制规则

Differential Pairs Routing:差分对布线规则

 

SMT(表贴焊盘规则)

SMD To Corner:SMD焊盘与导线拐角处最小间距规则

SMD To Plane:SMD焊盘与电源层过孔最小间距规则

SMD Neck Down:SMD焊盘颈缩率规则

 

Mask(阻焊层规则)

Solder Mask Expansion:阻焊层收缩量规则

Paste Mask Expansion:助焊层收缩量规则

 

Plane(电源层规则)

Power Plane Connect Style:电源层连接类型规则

Power Plane Clearance:电源层安全间距规则

Polygon Connect Style:焊盘与覆铜连接类型规则

 

TestPoint(测试点规则)

Testpoint Style:测试点样式规则

TestPoint Usage:测试点使用规则

 

Manufacturing(工业规则)

MinimumAnnularRing:焊盘铜环最小宽度规则,防止焊盘脱落。

Acute Angle:锐角限制规则

Hole Size:孔径限制规则

Layer Pairs:配对层设置规则,设定所有钻孔电气符号(焊盘和过孔)的起始层和终止层。

Hole To Hole Clearance:孔间间距桂鄂

Minimum SolderMask Sliver:

Silkscreen Over Component Pads:丝印与元器件焊盘间距规则

Silk To Silk Clearance:丝印间距规则

Net Antennae:网络天线规则

 

High Speed(高频电路规则)

ParallelSegment:平行铜膜线段间距限制规则

Length:网络长度限制规则

Matched Net Lengths:网络长度匹配规则

Daisy Chain Stub Length:菊花状布线分支长度限制规则

Vias Under SMD:SMD焊盘下过孔限制规则

Maximum Via Count:最大过孔数目限制规则

 

Placement(元件布置规则)

Room Definition:元件集合定义规则

Component Clearance:元件间距限制规则

Component Orientations:元件布置方向规则

Permitted Layers:允许元件布置板层规则

Nets To Ignore:网络忽略规则

Hight:高度规则

 

Signal Integrity(信号完整性规则)

Signal Stimulus:激励信号规则

Undershoot-Falling Edge:负下冲超调量限制规则

Undershoot-Rising Edge:正下冲超调量限制规则

Impedance:阻抗限制规则

Signal Top Value:高电平信号规则

Signal Base Value:低电平信号规则

Flight Time-Rising Edge:上升飞行时间规则

Flight Time-Falling Edge:下降飞行时间规则

Slope-Rising Edge:上升沿时间规则

Slope-Falling Edge:下降沿时间规则

Supply Nets:电源网络规则


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