8155/8195/8295参数对比

最新参数对比:8155/8255/8295参数对比

SoC Chipset Feature Comparison

Feature

SA8155P

SA8195P

SA8295P

Process 7 nm 7 nm 5 nm
Package 23 mm × 23 mm × 2.26 mm FCBGA+HS  15 mm × 20 mm × 1.90 mm FCBGA+HS  25 mm × 25 mm × 2.25 mm FCBGA+HS
BGA pitch  0.7 mm 0.4 mm 0.6 mm
AECQ Grade 3 Grade 3 Grade 3
CPU Qualcomm ® Kryo™ 485, 2 MB L3
1 x Gold prime core up to 2.419 GHz
3 x Gold cores up to 2.131 GHz
4 x Silver cores up to 1.785 GHz
Kryo 495, 4 MB L3
4 x Gold prime core up to 2.496 GHz
4 x Silver cores up to 1.766 GHz
Kryo 695, 8 MB L3
4 x Gold prime core up to 2.5 GHz
4 x Gold cores up to 2.05 GHz
DMIPS 105K todo 220K
Memory 4 × 16 LPDDR4X; up to 2092.8 MHz 8 × 16 LPDDR4X; up to 2092.8 MHz  8 × 16 LPDDR4X; up to 2092.8 MHz
GPU Qualcomm ® Adreno™ 640 Adreno 680  Adreno 695
AI/NSP V66, 4 x Qualcomm ® Hexagon™ Vector
eXtensions (Qualcomm ® Hexagon™ Vector
eXtensions (HVX)), 1 x HCP, up to 1.459 GHz
V66, 4 x HVX, 1 x HCP, up to 1.459 GHz  V68, 4 x HVX, 2 x HMX, up to 1.4 GHz
DPU Adreno DPU 895, 24 MP, DSC v1.1, up to
530 MHz
Adreno DPU 899, 40 MP, DSCv1.1, up to
530 MHz
Adreno DPU 1199, 64 MP, DSC v1.2, up
to 600 MHz
Camera Processor Qualcomm Spectra™ 380 ISP, 2.5 Gbps/lane,
40 Gbps total
Qualcomm Spectra 390, 2.5 Gbps/lane,
40 Gbps total
Qualcomm Spectra 395, 2.5 Gbps/lane,
40 Gbps total
VPU Adreno VPU 554, decode 4k120, encode 4k60,
concurrent 4k60/4k30 decode/encode
Adreno VPU 554, decode 4k120, encode
4k60, concurrent 4k60/4k30 decode/encode
Adreno VPU 665, decode 4k240, encode
4k120, concurrent 4k120 decode/encode
Audio V66 512 KB L2 up to 1.459 GHz  V66 512 KB L2 up to 1.459 GHz V66 2 MB L2 up to 1.459 GHz
Security SPU230 SPU230 SPU250
Functional
safety
Safety Element out of Context (SEooC)
targeting assumed ASIL B use cases
Safety Element out of Context (SEooC)
targeting assumed ASIL B use cases
Safety Element out of Context (SEooC)
targeting assumed ASIL B use cases.
Contains dedicated Safety Manager
sub-system, with lock step core
Junction temp -40°C to +105°C  -40°C to +105°C  -40°C to +115°C
Display - DP 4-lane DisplayPort v1.4 shared with
USB 3.1 Gen 2
3 x 4-lane DisplayPort v1.4, 2x shared with
USB 3.1 Gen 2
1 x 4-lane embedded DisplayPort v1.4b
3 x 4-lane DisplayPort v1.4, 1 x shared with USB
3.1 Gen 2
4 x 4-lane embedded DisplayPort v1.4b
Display - DSI DSI D-PHY v1.2
4-lane DSI0
4-lane DSI1
DSI D-PHY v1.2
4-lane DSI0
4-lane DSI1
DSI D-PHY v1.2
4-lane DSI0
4-lane DSI1
Camera – CSI CSI-2 v1.3
4-lane CSI0
4-lane CSI1
4-lane CSI2
4-lane CSI3
CSI-2 v1.3
4-lane CSI0
4-lane CSI1
4-lane CSI2
4-lane CSI3
CSI-2 v1.3
4-lane CSI0
4-lane CSI1
4-lane CSI2
4-lane CSI3
CCI-I2C x4 x8 x8
Audio – LS-I2S 4 x 2 data lanes each
1 x 4 data lanes each
4 x 2 data lanes each
1 x 4 data lanes each
6 x 2 data lanes each
1 x 4 data lanes each
Audio – HS-I2S 3 x 2 data lanes each, receive only 3 x 2 data lanes each, receive only 5 x 2 data lanes each, receive only
Audio – TDM/PCM 4 x 2 data lanes each
1 x 4 data lanes each
4 x 2 data lanes each
1 x 4 data lanes each
6 x 2 data lanes each
1 x 4 data lanes each
Storage – UFS  2 lane UFS 2.1 gear 3 rate A 2 x 2 lane UFS 3.0 gear 4 rate A 2 x 2 lane UFS 3.1 gear 4 rate B
PCIe 1-lane PCIe 3 (RC)
2-lane PCIe 3 (RC/EP)
1 x 1-lane PCIe 3 (RC)
2 x 2-lane PCIe 3 (RC)
1 x 4-lane PCIe 3 (RC/EP)
1 x 1-lane PCIe 3 (RC/EP)
2 x 4-lane PCIe 3 (RC/EP)
Ethernet –
RGMII/RMII
1 x with MDIO 1.8 V only  1 x with MDIO 1.8 V only 2 x with MDIO 1.8 V or 2.5 V
USB 1 x USB 3.1 Gen 2 shared with
DisplayPort
1 x USB 3.1 Gen 2
2 x USB3.1 Gen 2 shared with DisplayPort
2 x USB3.1 Gen 2
4 x USB3.1 Gen 2 1x shared with DisplayPort
2 x USB2.0
Functional safety - - 20 SM-GPIOs
1 x SPI – master
1 x SPI – slave
2 x I2C – master
2-lane UART – master
4 x clock monitors
44 x voltage monitors
3 x on-board thermal monitors
Miscellaneous
SPI
I 2 C
UART
GPIO
26 x QUP SE (GPIO + SSC)
Master and slave
Master
Host
174 GPIOs
26 x QUP SE (GPIO+SSC)
Master and slave
Master
Host
190 GPIOs
32 x QUP SE (GPIO+SSC)
Master and slave
Master
Host
228 GPIOs
PMIC 20 x GPIOs
3 x AMUX
30 x GPIOs
5 x AMUX
32 x GPIOs
7 x AMUX

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