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chapter six Static CMOS Design
sequential logic a combinational logic portion and a module that holds the state
static complementary CMOS output is either V D D V_{DD} VDD or V S S V_{SS} VSS through a low-resistance path.
dynamic circuit class relies on temporary storage of signal values on the capacitance of high-impedance circuit nodes. simpler and faster sensitive to noise
pull-up network PUN PMOS
pull-down network PDN NMOS
series devices and parallel devices duality principle
N-input logic gate is 2N
sub-nets(SN)
Static properties: (Noise Margin)
Propagation Delay:
depends upon the input patterns
t p L H = 0.69 R p C L t_{pLH}=0.69R_pC_L tpLH=0.69RpCL
t p H L = 0.69 ( 2 R N C L ) t_{pHL}=0.69(2R_NC_L) tpHL=0.69(2RNCL)
To make the same delay, NMOS devices must be made twice as wide. PMOS remain unchanged.
High-to-low propagation delay depends on the state of the internal nodes.
PMOS devices have a lower mobility relative to NMOS devices, stacking devices in series must be avoided as much as possible.
NAND is better than NOR.
t p H L = 0.69 ( R 1 C 1 + ( R 1 + R 2 ) C 2 + ( R 1 + R 2 + R 3 ) C 3 + ( R 1 + R 2 + R 3 + R 4 ) C L ) t_{pHL}=0.69(R_1C_1+(R_1+R_2)C_2+(R_1+R_2+R_3)C_3+(R_1+R_2+R_3+R_4)C_L) tpHL=0.69(R1C1+(R1+R2)C2+(R1+R2+R3)C3+(R1+R2+R3+R4)CL)
= 0.69 R N ( C 1 + 2 C 2 + 3 C 3 + 4 C L ) =0.69R_N(C_1+2C_2+3C_3+4C_L) =0.69RN(C1+2C2+3C3+4CL)
Conclusion:
Solution:
Transistor Sizing be used with caution
Progressive Transistor Sizing: M 1 > M 2 > M 3 > M 4 M_1>M_2>M_3>M_4 M1>M2>M3>M4 not simple in a real layout
Input Re-Ordering: critical path
Logic Restructuring
t p = t p 0 ( 1 + C e x t γ C g ) = t p 0 ( 1 + f / γ ) t_p=t_{p0}(1+\frac{C_{ext}}{\gamma C_{g}})=t_{p0}(1+f/\gamma) tp=tp0(1+γCgCext)=tp0(1+f/γ)
Modify: t p = t p 0 ( p + g f / γ ) t_p=t_{p0}(p+gf/\gamma) tp=tp0(p+gf/γ)
f f f :electrical effort
p p p: the ratio of the intrinstic delays of the complex gate and the simple inverter
g g g: logic effort
h h h: gate effort
Make t p t_p tp minimal: f 1 g 1 = f 2 g 2 = f 3 g 3 = . . . = f N g N f_1g_1=f_2g_2=f_3g_3=...=f_Ng_N f1g1=f2g2=f3g3=...=fNgN
F = f 1 f 2 f 3 f 4 . . f N = C L / C g 1 F=f_1f_2f_3f_4..f_N=C_L/C_{g1} F=f1f2f3f4..fN=CL/Cg1 G = g 1 g 2 . . . g N G=g_1g_2...g_N G=g1g2...gN H = F G H=FG H=FG
h = F G N = H N h=\sqrt[N]{FG} = \sqrt[N]{H} h=NFG=NH
Power Consumption:
dynamic power dissipation: α 0 − > 1 C L V D D 2 f \alpha_{0->1}C_LV_{DD}^{2}f α0−>1CLVDD2f switching activity
Logic function: α 0 − > 1 = p 0 p 1 = p 0 ( 1 − p 0 ) \alpha_{0->1}=p_{0}p_{1}=p_{0}(1-p_{0}) α0−>1=p0p1=p0(1−p0)
Assuming the inputs are independent and uniformly distributed
α 0 − > 1 = N 0 2 N N 1 2 N \alpha_{0->1}=\frac{N_{0}}{2^{N}}\frac{N_{1}}{2^{N}} α0−>1=2NN02NN1
Solutions: To reduce the switching factor
Logic Restructuring
Input ordering
postpone the introduction of signals with a high transition rate
Time-multiplexing resources
can minimize the implementation area. Very few transitions
Glitch Reduction by balancing signal paths
Make every gate change simultaneously Redesigning the network
reduce robustness and extra power dissipation reduce number of gates N + 1 N+1 N+1
pseudo-NMOS gate nominal low output is not 0V
ratioed: voltage swing on the output and the overall functionality of the gate depends upon the ratio between the NMOS and PMOS sizes.
V O L ≈ μ p W p μ n W n ∣ V D S A T ∣ V_{OL}\approx\frac{\mu_pW_p}{\mu_nW_n}|V_{DSAT}| VOL≈μnWnμpWp∣VDSAT∣ To make V O L V_{OL} VOL smaller, PMOS needs to be sized much smaller, however, it is bad to propagation delay.
static power: P l o w = V D D I l o w P_{low}=V_{DD}I_{low} Plow=VDDIlow
differential logic and positive feedback:
DCVSL differetial cascode voltage switch logic
have rail-to-rail swing static power dissipation is eliminated
Of course, short circuit path still exists.
Reduced number of devices low capacitance
high output is V D D − V T n V_{DD}-V_{Tn} VDD−VTn low switching energy
pass-transistor gates cannot be cascaded by connecting the output of a pass gate to the gate input of another pass transistor.
may cosume static power when the output is high. insufficient to turn off the PMOS transistor of CMOS
Differential Pass Transistor Logic:
CPL DPL
Solutions:
can eliminates any static power dissipation in the inverter.
the resistance of M n M_n Mn and M r M_r Mr must be such that the voltage at node X X X drops below the threshold of the inverter.
The rise time of the gate is further negatively affected, since, the level-restoring transistor M r M_r Mr fights the decrease in voltage at node X X X
swing-restored pass transistor logic
Multiple-threshold transistors:
zero-threshold transistor can make the subthreshold currents
Transmission gate logic:
NMOS devices pass a strong 0 but a weak 1, while PMOS transistor pass a strong 1 but a weak 0.
rail-to-rail swing
can realize multiplexer and XOR gate using less transistors.
R e q R_{eq} Req is relatively constant.
t p = 0.69 ∑ k = 0 n C R e q k = 0.69 C R e q n ( n + 1 ) 2 t_p=0.69\displaystyle \sum^{n}_{k=0}CR_{eq}k=0.69CR_{eq}\frac{n(n+1)}{2} tp=0.69k=0∑nCReqk=0.69CReq2n(n+1)
solution:
break the chain and insert buffers every n n n switches.
t p = 0.69 [ n m C R e q m ( m + 1 ) 2 ] + ( n m − 1 ) t b u f t_{p}=0.69[\frac{n}{m}CR_{eq}\frac{m(m+1)}{2}]+(\frac{n}{m}-1)t_{buf} tp=0.69[mnCReq2m(m+1)]+(mn−1)tbuf
m o p t = 1.7 t p b u f C R e q ≈ 3 m_{opt}=1.7\sqrt{\frac{t_{pbuf}}{CR_{eq}}}\approx3 mopt=1.7CReqtpbuf≈3
to avoid the static power dissipation
precharge and evaluation phases determined by the signal C L K CLK CLK.
C L K = 1 CLK=1 CLK=1: evaluation phase
C L K = 0 CLK=0 CLK=0: precharge phase
During evaluation phase, the output can make at most one transition.
number of transistors: N + 2 N+2 N+2 numbers
non-ratioed
only consumes dynamic power
faster switching speeds
Speed and Power dissipation of dynamic logic
Problems:
Source 1 and 2: reverse-biased diode and sub-threshold leakage
require a minimal clock rate
solution: adding a bleeder transistor
charge sharing:
share capacitor C L C_{L} CL and C a C_{a} Ca
we need to keep the value of Δ V o u t \Delta V_{out} ΔVout below ∣ V t p ∣ |V_{tp}| ∣Vtp∣
solution:
precharge critical internal nodes
Capacitive coupling:
back-gate coupling
example: a dynamic two-input NAND gate drives a static NAND gate
clock-feedthrough:
causes the output of the dynamic node to rise above V D D V_{DD} VDD on the low-to-high transition of the clock.
may cause forward-biased.
Cascading Dynamic gates:
the inputs can only make a single 0->1 transition during the evaluation period.
Domino Logic:
consist of an n-type dynamic logic block followed by a static inverter.
pure Domino design has become rare.
high speed only a rising edge delay exists.
Dual-rail Domino
n p np np-CMOS