【Call for papers】ISSTA-2023(CCF-A/截稿日期: 2023年2月16日)

The ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA) is the leading research symposium on software testing and analysis, bringing together academics, industrial researchers, and practitioners to exchange new ideas, problems, and experience on how to analyze and test software systems.

文章目录

  • 1.会议信息
  • 2.时间节点

1.会议信息

会议介绍: ACM SIGSOFT的国际软件测试和分析研讨会(International Symposium on Software Testing and Analysis, ISSTA)是软件测试和分析的领先研究研讨会,汇集了学术界、工业界研究人员和实践者,交流关于如何分析和测试软件系统的新思想、问题和经验。

会议全称: International Symposium on Software Testing and Analysis

会议网址: https://conf.researchr.org/home/issta-2023

会议地点: Seattle downtown

CCF分类: A 类

Core分类: A* 类

H5指数: 36

影响力值: 5.12

录取率: ISSTA-22,录取率:24.4% (61/250)

2.时间节点

When Track What
Thu 10 Nov 2022 Technical Papers First round submission deadline
Tue 20 - Thu 22 Dec 2022 Technical Papers First round author response
Mon 16 Jan 2023 Technical Papers First round paper notification
Thu 16 Feb 2023 Technical Papers Second round submission deadline
Tue 11 - Thu 13 Apr 2023 Technical Papers Second round author response
Wed 3 May 2023 Technical Papers Second round paper notification

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